TY  - RPRT
TI  - Determining Stress in Metallic Conducting Layers of Microelectronics Devices Using High Resolution Electron Backscatter Diffraction and Finite Element Analysis
AU  - Ruggles, Timothy
AU  - Grutzik, Scott Joseph
AU  - Stephens, Kelly Suzanne
AU  - Michael, Joseph R.
PY  - 2023
DO  - 10.1093/micmic/ozad013
UR  - https://www.osti.gov/biblio/3019222
ID  - 3019222
ER  -