@misc{indiciae85090c1eccc5,
  title = {Deciphering Mechanical Damage Signatures in Epoxy Mold Compounds for Microelectronics Packaging},
  author = {Kropka, Jamie Michael [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0009000946517375) and Hiep-Vo, Vincent Phuc Thien [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] and Long, Kevin Nicholas [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0000000347184161)},
  year = {2025},
  doi = {10.2172/3027439},
  url = {https://www.osti.gov/biblio/3027439},
  note = {Source identifier: 3027439}
}