TY  - RPRT
TI  - Deciphering Mechanical Damage Signatures in Epoxy Mold Compounds for Microelectronics Packaging
AU  - Kropka, Jamie Michael [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0009000946517375)
AU  - Hiep-Vo, Vincent Phuc Thien [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)]
AU  - Long, Kevin Nicholas [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0000000347184161)
PY  - 2025
DO  - 10.2172/3027439
UR  - https://www.osti.gov/biblio/3027439
ID  - 3027439
ER  -