@misc{indiciae1a8fcb1d18d3,
  title = {A scalable framework for efficient coupling of thermal and microstructural simulations in additive manufacturing},
  author = {Stump, Benjamin [Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)] (ORCID:0000000212907262) and Coleman, John [Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)] (ORCID:0000000272613143)},
  year = {2026},
  doi = {10.1016/j.commatsci.2026.114832},
  url = {https://www.osti.gov/biblio/3395412},
  note = {Source identifier: 3395412}
}