@misc{indiciaeeb8e7b9205d1,
  title = {Enhancing 300 Degree Celsius Electronic Packaging with Ceramic PCBs and Advanced Interconnection Techniques},
  author = {Wright, Andrew Alexander [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0009000797691280) and Larson, Joshua David [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] and Coombes, Kenneth Roy [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0009000202997003) and Hagen, Deborah Ann [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0000000168663327) and Larson, Steven Robert [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0000000346810749)},
  year = {2026},
  doi = {10.2172/3403355},
  url = {https://www.osti.gov/biblio/3403355},
  note = {Source identifier: 3403355}
}