TY  - RPRT
TI  - Enhancing 300 Degree Celsius Electronic Packaging with Ceramic PCBs and Advanced Interconnection Techniques
AU  - Wright, Andrew Alexander [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0009000797691280)
AU  - Larson, Joshua David [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)]
AU  - Coombes, Kenneth Roy [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0009000202997003)
AU  - Hagen, Deborah Ann [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0000000168663327)
AU  - Larson, Steven Robert [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0000000346810749)
PY  - 2026
DO  - 10.2172/3403355
UR  - https://www.osti.gov/biblio/3403355
ID  - 3403355
ER  -