@misc{indiciaee7dd76a5d69a,
  title = {The Heterogeneous Integration of Electronic Components},
  author = {Mahajan, Ravi [Intel] and Chen, William [ASE Technologies] and Thompson, Patrick [Texas Instruments] and Bottoms, Wilmer [Third Millennium Test Solutions] and Helmy, Amr [University of Toronto] and Chan, Benson [Binghamton University] and Swaminathan, Madhavan [Pennsylvania State University] and Shalf, John [Lawrence Berkeley National Laboratory] and Bailey, Christopher [Arizona State University] and Schutt-Aine, Jose [University of Illinois at Urbana Champaign] and Subbarayan, Ganesh [Purdue University] and Lee, Timothy [Boeing] and Iyer, Subramanian [University of California Los Angeles] and Narumanchi, Sreekant [National Laboratory of the Rockies, Golden, CO (United States)] (ORCID:0000000153376069) and Mongia, Rajiv [Intel]},
  year = {2026},
  doi = {10.1038/s44287-026-00270-1},
  url = {https://www.osti.gov/biblio/3438655},
  note = {Source identifier: 3438655}
}