TY  - RPRT
TI  - The Heterogeneous Integration of Electronic Components
AU  - Mahajan, Ravi [Intel]
AU  - Chen, William [ASE Technologies]
AU  - Thompson, Patrick [Texas Instruments]
AU  - Bottoms, Wilmer [Third Millennium Test Solutions]
AU  - Helmy, Amr [University of Toronto]
AU  - Chan, Benson [Binghamton University]
AU  - Swaminathan, Madhavan [Pennsylvania State University]
AU  - Shalf, John [Lawrence Berkeley National Laboratory]
AU  - Bailey, Christopher [Arizona State University]
AU  - Schutt-Aine, Jose [University of Illinois at Urbana Champaign]
AU  - Subbarayan, Ganesh [Purdue University]
AU  - Lee, Timothy [Boeing]
AU  - Iyer, Subramanian [University of California Los Angeles]
AU  - Narumanchi, Sreekant [National Laboratory of the Rockies, Golden, CO (United States)] (ORCID:0000000153376069)
AU  - Mongia, Rajiv [Intel]
PY  - 2026
DO  - 10.1038/s44287-026-00270-1
UR  - https://www.osti.gov/biblio/3438655
ID  - 3438655
ER  -