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electroplating

electroplating: explore 2 source-linked works published from 2026 to 2026, with original documents and citations.

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Progress and Perspectives: Zirconium Electrodeposition from Different Electrolytes

Zirconium (Zr) possesses outstanding properties, including exceptional chemical resistance and a high melting point, and is therefore desirable for use in a wide variety of challenging environments, such as in nuclear reactors and the chemical processing industry. To minimize the amount of Zr required for any given application, developing methods for generating metallic Zr coatings is highly advantageous. Owing to Zr’s highly negative reduction potential, electrodeposition in traditional solvents at near ambient temperatures remains challenging and thus not well understood. Due to the extreme conditions required to deposit this metal, extensive work has been conducted in molten salt electrolytes, however the broad applicability of this methodology is limited due to its corrosivity. The primary focus of this article is to present an overview of Zr’s electrochemical behavior and to consolidate the efforts of researchers in exploring electrodeposition techniques for Zr involving aqueous, organic, ionic liquid, deep eutectic, and molten salt solvents. With this information, we highlight trends across solvent systems and opportunities for future research.

42 ENGINEERING

Optimization of X-ray Absorbers for High-Resolution TES Detectors in NewATHENA X-IFU

NewATHENA’s X-ray Integral Field Unit (X-IFU) uses a large-format array of Transition Edge Sensor (TES) microcalorimeters coupled with absorbers made of gold and bismuth providing 4 eV FWHM resolution up to 7 keV in the 0.2- 12 keV band. X-ray absorbers must be thick enough for photon absorption, maintain low heat capacity for energy resolution, and have good thermalization properties. The X-IFU requires total Quantum Efficiency (QE) of 96%, 87%, and 63% at 1, 7, and 9.5 keV, respectively. Optimal thicknesses are 1.05 µm gold and 5.5 µm bismuth to achieve 0.731 pJ/K at 90 mK and 87% QE at 7 keV. While typical TES absorbers are 3-4 µm thick, producing the required 5.5 µm Bi absorbers via standard electroplating creates enlarged grains and surface roughness. The increased roughness and grain size variability produced with our standard recipe have resulted in instances of 1) low energy spectral tails 2) spectral broadening of the energy resolution and 3) thermal shorts between pixels when a large grain bridges the gap between absorbers. In this study, we have introduced a new fabrication process and altered the morphology of the thick Bi through changes in the electroplating process. The process changes are intended to address all three issues as well as reduce particulate contamination observed on the finished detector arrays.

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