subject
interconnection: explore 1 source-linked works published from 2026 to 2026, with original documents and citations.
This collection is a preview while coverage and quality are evaluated.
Includes records with this source-supplied label or an explicit phrase match in their metadata. Matches indicate a mention, not proof that a paper uses a method or tests a material. Source versions are consolidated by DOI.
Sources: osti. Collection updated 2026-09-15. Counts describe this index, not the complete source archives.
This work will focus on analysis of defects in modules fabricated using a conductive backsheet. While most defect types are known, reasonable methods for easily detecting manufactured defects are still relatively unknown.