NASA NTRS · 19660000004
Copper foil provides uniform heat sink path
Abstract
Thermal path prevents voids and discontinuities which make heat sinks in electronic equipment inefficient. The thermal path combines the high thermal conductivity of copper with the resiliency of silicone rubber.
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Phillips, I. E., Jr., Schreihans, F. A.. 1966-01-01. Copper foil provides uniform heat sink path. https://ntrs.nasa.gov/citations/19660000004
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