NASA NTRS · 19670000356
Reparable, high-density microelectronic module provides effective heat sink
Abstract
Reparable modular system is used for packaging microelectronic flat packs and miniature discrete components. This three-dimensional compartmented structure incorporates etched phosphor bronze sheets and frames with etched wire conductors. It provides an effective heat sink for electric power dissipation in the absence of convective cooling means.
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Carlson, K. J., Maytone, F. F.. 1967-10-01. Reparable, high-density microelectronic module provides effective heat sink. https://ntrs.nasa.gov/citations/19670000356
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