NASA NTRS · 19670000592
Solvent permits solid curing agents to be used at room temperatures
Abstract
Solvent system dissolves the solid curing agents used with polyurethane resins in adhesive systems. The system developed yields bond strengths comparable to 100 percent solid formulations. The optimum solvent chosen was a 55.5 percent solution in anhydrous tetrahydrofuran.
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St. Cyr, M. C.. 1967-12-01. Solvent permits solid curing agents to be used at room temperatures. https://ntrs.nasa.gov/citations/19670000592
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