NASA NTRS · 19680000307
Encapsulation technique eliminates thermal stresses in welded electronic modules
Abstract
Encapsulation technique minimizes embedment and thermal stresses in welded electronic modules. A coating of thinned room-temperature- vulcanizing silicone rubber having a high coefficient of expansion and flexibility at low temperature, is applied first and then an encapsulating epoxy resin having a relatively low coefficient of expansion is added.
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Kimmel, M.. 1968-08-01. Encapsulation technique eliminates thermal stresses in welded electronic modules. https://ntrs.nasa.gov/citations/19680000307
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