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NASA NTRS ยท 19680000310

Standards for compatibility of printed circuit and component lead materials

Abstract

Study of packaging of microminiature electronic components reveals methods of improving compatibility of lead materials, joining techniques, transfer molding concepts, printed circuit board materials, and process and material specifications.

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BibTeXRIS

1968-08-01. Standards for compatibility of printed circuit and component lead materials. https://ntrs.nasa.gov/citations/19680000310

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