NASA NTRS · 19690000442
Modular packaging technique for combining integrated circuits and discrete components
Abstract
Technique for packaging electronic modules interconnects integrated circuits and discrete components by means of beryllium-copper strips in a molded diallyphthalate tray. Simple girder-like construction provides ease of assembly, high rigidity, excellent vibration resistance, and good heat dissipation characteristics.
Keep this discovery
Explore connections, maps & timelines
Lacchia, J. F.. 1969-09-01. Modular packaging technique for combining integrated circuits and discrete components. https://ntrs.nasa.gov/citations/19690000442
Cite the original work for its findings. Save a collection to share your selection of sources.