NASA NTRS · 19700000364
Coplanar interconnection module
Abstract
Module for interconnecting a semiconductor array to external leads or components incorporates a metal external heat sink for cooling the array. Heat sink, extending down from the molded block that supports the array, is immersed in a liquid nitrogen bath which is designed to maintain the desired array temperature.
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Steward, R. D., Windsor, H. F.. 1970-08-01. Coplanar interconnection module. https://ntrs.nasa.gov/citations/19700000364
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