NASA NTRS · 19700056209
Glass bonding techniques for semiconductor strain gages
Abstract
Glass bonding techniques for semiconductor strain gages, discussing outgassing minimization, hysteresis and repeatability and operational temperature range extension
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Gravel, C., Leasure, W. A., Jr., Woodruff, N.. 1970-05-01. Glass bonding techniques for semiconductor strain gages. https://ntrs.nasa.gov/citations/19700056209
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