NASA NTRS · 19710000083
Ceramic wiring board increases packaging density of electronic modules
Abstract
Ceramic multilayer wiring board interconnects large scale integration /LSI/ modules which dissipate nearly 2W/cc. Extremely high packaging density is possible by application of alumina cover hermetically sealed to board. Signal interconnections are completely dependent on transfer heat between layers.
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Hamley, L. D., Martin, J. H.. 1971-04-01. Ceramic wiring board increases packaging density of electronic modules. https://ntrs.nasa.gov/citations/19710000083
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