NASA NTRS · 19720004767
Study of bonding methods for flip chip and beam leaded devices
Abstract
The results are presented of a comprehensive study and evaluation for the bonding of flip chip and beam leaded devices onto hybrid microcircuit substrates used in high reliability space applications. The program included the evaluation of aluminum flip chips, solder (silver/tin) bump chips, gold beam leaded devices, and aluminum beam leaded devices.
Keep this discovery
Explore connections, maps & timelines
Rudd, H. C., Colbert, D. C.. 1971-10-01. Study of bonding methods for flip chip and beam leaded devices. https://ntrs.nasa.gov/citations/19720004767
Cite the original work for its findings. Save a collection to share your selection of sources.