Heat resistant composite structure for shuttle applications (Ryton-B)

Abstract

A program was undertaken to characterize Ryton-B resin, develop graphite filament prepregs, undirectional laminates and determine the strength and heat resistance of the composite system. Through the use of a water soluble resin binder, high quality prepreg tape, three inches wide with 4 tows of HM-S were produced. The tape laminated to 0.00175 inch per ply. A wide range of properties in the cured resin and laminate were found using different curing conditions. The thermal stability and strength of molded laminates appears to be very dependent upon the cure cycle used for polymerization.