Silicon solar cell interconnectors for low temperature applications.

Abstract

Discussion of the design and techniques of solar cell interconnections meeting the requirements of mission life expectancies of 5 to 10 years in the face of the vibration stresses of launch and the stresses induced (especially between dissimilar materials with different thermal coefficients of expansion) by thermal cycling throughout the mission. Generalized stress equations are developed that give the minimum stress relief loop dimensions for a 'no fatigue' interconnector. Also, the thermal expansion stresses induced at the metal-to-silicon interface were investigated and generalized equations developed for determining the stresses in each of the members. These relationships, as verified by experimental tests, can be used to determine the maximum allowable interconnector thickness for failure prevention in thermal cycling environments.