NASA NTRS · 19730000054
Glass encapsulation provides extra protection for IC semiconductor devices
Abstract
Oxide-passivated semiconductor chip is given protective glass coating by means of vapor deposition over metallic substrate of integrated circuit (IC). Method provides more reliable oxide-passivation and hermetic sealing in current use. Chips and scratches incurred during dicing, testing, and assembly are markedly reduced.
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Doelp, W. L., Jr.. 1973-01-01. Glass encapsulation provides extra protection for IC semiconductor devices. https://ntrs.nasa.gov/citations/19730000054
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