NASA NTRS · 19730000512
New standoffs provide high-reliability component mounting for printed wiring boards
Abstract
Designs provide such advantages as inspectable solder joints from both sides of boards; stress relief in lead wires; low-impedance thermal paths; matched coefficients of lead wire thermal expansion; minimum webbing of conformal coatings to lead wires; positive mounting of part bodies to boards; and conductive mass for transient heat sink requirements.
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Mccandliss, W. H.. 1974-03-01. New standoffs provide high-reliability component mounting for printed wiring boards. https://ntrs.nasa.gov/citations/19730000512
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