NASA NTRS · 19730017854
Development and evaluation of polyimide laminates for printed wiring board applications
Abstract
A developmental and evaluation program on polyimide laminates as printed wiring boards is described. The development of an experimental polyimide with low linear coefficient of thermal expansion normal to the plane of the board is discussed, and its properties are evaluated along with two commercial polyimide printed wiring boards for comparison with the type G-10 epoxy board. Thermal cycling data indicate an urgent need for effectively controlling the expansion normal to the plane of the board in order to minimize solder joint damage.
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Patterson, W. J.. 1973-06-12. Development and evaluation of polyimide laminates for printed wiring board applications. https://ntrs.nasa.gov/citations/19730017854
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