NASA NTRS · 19750000312
Quality control of microelectronic wire bonds
Abstract
Report evaluates ultrasonic bonding of small-diameter aluminum wire joined to ceramic substrates metalized with thin-film and thick-film gold. Quick testing technique for nondestructive location of poor wire bonds is also presented.
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Thiel, R. A., Schmidt, G. D.. 1975-12-01. Quality control of microelectronic wire bonds. https://ntrs.nasa.gov/citations/19750000312
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