NASA NTRS · 19760000159
Guidelines for multiple LSI packaging
Abstract
Handbook provides specific guidelines related to ceramic multilayer circuit fabrication in terms of packaging density and interconnection methods, guiding the designer from initial stages of ceramic multilayer interconnection and artwork generation through test pattern utilization, assembly operations, and final inspection and test procedures.
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Peckinpaugh, C. J.. 1976-08-01. Guidelines for multiple LSI packaging. https://ntrs.nasa.gov/citations/19760000159
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