NASA NTRS · 19760000360
Purity test for copper-plating solutions
Abstract
Electrode configuration can be used to measure extent of impurities in acid-copper plating solution. It can be inserted into any plating tank and will show whether bath is clean or contaminated, within fifteen minutes.
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Mansfeld, F. B.. 1977-01-01. Purity test for copper-plating solutions. https://ntrs.nasa.gov/citations/19760000360
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