NASA NTRS · 19760005098
The development of low temperature curing adhesives
Abstract
An approach for the development of a practical low temperature (293 K-311 K/68 F-100 F) curing adhesive system based on a family of amide/ester resins was studied and demonstrated. The work was conducted on resin optimization and adhesive compounding studies. An improved preparative method was demonstrated which involved the reaction of an amine-alcohol precursor, in a DMF solution with acid chloride. Experimental studies indicated that an adhesive formulation containing aluminum powder provided the best performance when used in conjunction with a commercial primer.
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Green, H. E., Sutherland, J. D., Hom, J. M., Sheppard, C. H.. 1975-12-01. The development of low temperature curing adhesives. https://ntrs.nasa.gov/citations/19760005098
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