NASA NTRS · 19770000324
Potting procedure for electronic components
Abstract
Potting process is modified to effect a match more closely between embedded electronic components, potting mediums, and thermal environment. Application of room-temperature vulcanizing silicone rubber band cured in modified thermal cycle minimizes coil-to-resin adhesion and thus lowers stresses between transformer and potting compound.
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Rubino, A. G., Zimmerman, J.. 1977-11-01. Potting procedure for electronic components. https://ntrs.nasa.gov/citations/19770000324
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