NASA NTRS · 19770000443
Bonding aluminum beam leads
Abstract
Report makes it relatively easy for hybrid-circuit manufacturers to convert integrated circuit chips with aluminum bead leads. Report covers: techniques for handling tiny chips; proper geometries for ultrasonic bonding tips; best combinations of pressure, pulse time, and ultrasonic energy for bonding; and best thickness for metal films to which beam leads are bonded.
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Burkett, F. S.. 1978-03-01. Bonding aluminum beam leads. https://ntrs.nasa.gov/citations/19770000443
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