Industrialization of the ion plating process

Abstract

A new process referred to as ion plating by induction heating (IPIH) is described, which combines the advantages of both ion plating and induction heating. The IPIH apparatus consists of the specimen (cathode) to be coated and the evaporation heating source, which is a ceramic crucible containing the metal to be heated. The specimen is an internal part of the high-voltage ceramic-metal vacuum feedthrough and is connected to the negative terminal of the high-voltage power supply, the positive terminal of the power supply being grounded. The plating conditions are the same as those most commonly used in industrial ion plating. A number of metals - such as nickel, iron, platinum - which were practically impossible to deposit by resistance heating evaporation can now be effectively evaporated and deposited to any desired thickness. Excellent adherence is observed for many metals deposited on various metal surfaces in thicknesses from 0.15 to 50 microns, regardless of the materials selected for coating and substrate.