NASA NTRS · 19780016707
Array automated assembly, phase 2
Abstract
An analysis was made of cost tradeoffs for shaping modified square wafers from cylindrical crystals. Tests were conducted of the effectiveness of texture etching for removal of surface damage on sawed wafers. A single step texturing etch appeared adequate for removal of surface damage on wafers cut with multiple blade reciprocating slurry saws.
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Taylor, W. E.. 1978-02-01. Array automated assembly, phase 2. https://ntrs.nasa.gov/citations/19780016707
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