High temperature compressive cracking in hot-pressed silicon nitride

Abstract

Results are presented for high-temperature (1370, 1430, 1540, 1590 C) slow-strain-rate compression tests on cylindrical specimens of hot-pressed Si3N4 of the HS-130 brand under various compressive loads. The results are presented in terms of number of longitudinal cracks, percent increase in diameter, percent decrease in length, and percent loss in weight. Scanning electron micrographs are presented of cylindrical surfaces of compression specimens tested at 1430 C for 640 MN/sq m and at 1590 C for 220 MN/sq m. As compared to results obtained by other investigators, it appears more likely that the cracks resulting from compressive loading are due to subcritical crack growth caused by circumferential tensile stresses acting across grain boundaries that contain a viscous silicate glass phase.