NASA NTRS · 19790000315
Moisture penetration in microcircuit packages
Abstract
Results of study of hybrid microcircuit packages tested in temperature/humidity environments ranging from 25 C at 98 percent relative humidity (RH) to 85 C at 85 percent RH shows that package susceptibility to moisture is affected more by high temperature than humidity, and room temperature tests are inadequate for testing package seal integrity.
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Licari, J. J., Perkins, K. L.. 1980-04-01. Moisture penetration in microcircuit packages. https://ntrs.nasa.gov/citations/19790000315
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