Integral glass encapsulation for solar arrays

Abstract

Electrostatic bonding technology, an encapsulation technique for terrestrial solar array was developed. The process produces full integral, hermetic bonds with no adhesives or pottants. Panels of six solar cells on a simple glass superstrate were produced. Electrostatic bonding for making the cell front contact was also developed. A metal mesh is trapped into contact with the cell front during the bonding process. Six cell panels using the bonded mesh as the only cell front contact were produced. The possibility of using lower cost glass, with a higher thermal expansion mismatch to silicon, by making lower temperature bonds is developed. However, this requires a planar surface cell.