NASA NTRS · 19820015776
Comparison of various silicon sawing methods
Abstract
The technology and economics of four methods of wafering silicon boules of large cross section are described. Slurry sawing using either blades or wires, and fixed abrasive sawing using the ID saw or by the FAST method, having the abrasive attached to wires which are arranged in a blade pack, are considered. The technical performance of each method is evaluated and cost/price estimates are summarized.
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Wolf, M.. 1982-02-01. Comparison of various silicon sawing methods. https://ntrs.nasa.gov/citations/19820015776
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