NASA NTRS · 19830000236
Low-Cost Alternatives in Hybrid Microcircuit Packaging
Abstract
Adhesive sealing, nickel plating, and multiwire boards evaluated. Based on study involving fully developed hardware, report considers adhesive packaging instead of seam welding, nickel-plated Kovar (commercial Fe/NI/Co alloy) packages instead of gold plates ones, and multiwire circuit boards instead of multilayer boards as alternatives for reducing cost of hardware without reducing reliability.
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Caruso, S. V., Champion, V. L., Bassett, R. N., Gayer, J. N.. 1983-10-01. Low-Cost Alternatives in Hybrid Microcircuit Packaging. https://ntrs.nasa.gov/citations/19830000236
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