NASA NTRS · 19830000268
Ti/Pd/Cu Contacts for Semiconductor Devices
Abstract
Copper systems equivalent in performance to silver or gold systems. Titanium layer and palladium layer deposited on semiconductor device by electron beam evaporation. Desired pattern etched using photoresist. Thin layer of copper plated on contact pattern from cyanide solution. Copper layer then built up to 4 to 8 microns by electroplatng from acid solution.
Keep this discovery
Explore connections, maps & timelines
Campbell, R. B., Rohatgi, A.. 1984-04-01. Ti/Pd/Cu Contacts for Semiconductor Devices. https://ntrs.nasa.gov/citations/19830000268
Cite the original work for its findings. Save a collection to share your selection of sources.