NASA NTRS · 19830000703
Repairable Encapsulated Electronic Modules
Abstract
Packaging technique seals electronic modules as effectively as potting in epoxy, yet permits removal of encapsulant when component change necessary. Technique encloses module in thin, rigid epoxy/fiberglass shell containing lightweight syntactic foam.
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Dozois, P. C., Mayne, R. C.. 1984-12-01. Repairable Encapsulated Electronic Modules. https://ntrs.nasa.gov/citations/19830000703
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