Development of metallization process: FSA project, cell and module formation research area

Abstract

The use of CO in place of H2 for the reducing step did not appreciably increase solderability of interconnects. Cells were also made printing the pastes on top of ITO coatings. Some of these cells were the best electrically but the metallization was still not adhering. Sequential use of H2 and CO had no effect on adhesion (or lack of it).