Minimum silicon wafer thickness for ID wafering

Abstract

An analytical model, based on fracture mechanics analysis, is proposed for estimating the minimum wafer thickness as a function of the diameter requirement for solar cells. The conditions under which the model can be applied are discussed with reference to the critical flaw size, the applied force, and the width of the side support. It is shown that the equivalent cantilever force applied during ID slicing can be estimated from the wafering mechanical yield data. The width of the wafer side support was found to be a significant factor in controlling the minimum allowable wafer thickness during slicing. Wafer side support width requirements were found to increase with decreasing wafer thickness.