NASA NTRS · 19840000387
Solder Bonding for Power Transistors
Abstract
Indium solder boosts power rating and facilitates circuit changes. Efficient heat conduction from power transistor to heat sink provided by layer of indium solder. Low melting point of indium solder (141 degrees C) allows power transistor to be removed, if circuit must be reworked, without disturbing other components mounted with ordinary solder that melts at 181 degrees C. Solder allows devices operated at higher power levels than does conventional attachment by screws.
Keep this discovery
Explore connections, maps & timelines
Snytsheuvel, H. A., Mandel, H.. 1985-04-01. Solder Bonding for Power Transistors. https://ntrs.nasa.gov/citations/19840000387
Cite the original work for its findings. Save a collection to share your selection of sources.