NASA NTRS · 19850024126
Stress and buckling analysis
Abstract
An analysis is presented of elastic stress and buckling behavior due to thermal stresses in silicon ribbon. Thermal profiles for reducing stresses and improving flatness in wide ribbon are discussed.
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Dillon, O. W., Jr.. 1984-10-01. Stress and buckling analysis. https://ntrs.nasa.gov/citations/19850024126
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