Multifunction Vacuum Chamber for IC Metallization

Abstract

Vacuum system chamber processing multilayer metallization on integrated circuits (IC's) performs four operations ordinarily done in separated equipment. Chamber etches holes, removes photoresist, cleans by sputter etching, and deposits final layer of metal. Combinedfunction chamber costs less than separate equipment. Chamber avoids exposing integrated circuits to room air and, to oxidation and dust, between steps. Eliminates time spent in transferring circuits from one apparatus to next.