New processable modified polyimide resins for adhesive and matrix applications

Abstract

A broad product line of bismaleimide modified epoxy adhesives which are cured by conventional addition curing methods is described. These products fill a market need for 232 C (450 F) service adhesives which are cured in a manner similar to conventional 177 C (350 F) epoxy adhesives. The products described include film adhesives, pastes, and a primer. Subsequent development work has resulted in a new bismaleimide modified epoxy resin which uses a unique addition curing mechanism. This has resulted in products with improved thermomechanical properties compared to conventional bismaleimide epoxy resins. A film adhesive, paste, and matrix resin for composites using this new technology are described. In all cases, the products developed are heat cured by using typical epoxy cure cycles i.e., 1 hour at 177 C (350 F) followed by 2 hours postcure at 246 C (475 F).