NASA NTRS · 19890000312
Thermal Stresses In Space-Shuttle Wing
Abstract
Combined thermal deformations of wing-skin panel and TPS would not tear SIP layer. Report presents analysis of thermal stresses induced in skin panel, thermal-protection system (TPS), and strain-isolation pad (SIP) of Space Shuttle orbiter. Purpose of analysis to determine whether any part of above mentioned structures overstressed and overdeformed under reentry heating, assuming one TPS tile lost at end of reentry heating.
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Ko, William L., Jenkins, Jerald M.. 1989-06-01. Thermal Stresses In Space-Shuttle Wing. https://ntrs.nasa.gov/citations/19890000312
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