NASA NTRS · 19890000570
Removing Bonded Integrated Circuits From Boards
Abstract
Small resistance heater makes it easier, faster, and cheaper to remove integrated circuit from hybrid-circuit board, package, or other substrate for rework. Heater, located directly in polymeric bond interface or on substrate under integrated-circuit chip, energized when necessary to remove chip. Heat generated softens adhesive or solder that bonds chip to substrate. Chip then lifted easily from substrate.
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Rice, John T.. 1989-11-01. Removing Bonded Integrated Circuits From Boards. https://ntrs.nasa.gov/citations/19890000570
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