Thermal grease replacement for the modular power subsystem

Abstract

A comparative thermal conductance test was conducted to evaluate thermal interface materials for use on the Modular Power Subsystem. Materials tested included three thermal pads, four RTV adhesives, bare metal, and one thermal grease. The tests were conducted in a bell jar at vacuum conditions using a 1400 square centimeter footprint and two relatively low contact pressures, 207 kPa and 620 kPa. Power inputs ranged from 100 to 500 watts, and the thermal interface conductance values ranged from 100 to 1700 W/m2 C for the interstitial materials tested. In general, the thermal pads performed a little better than bare metal, while the RTV adhesives performed significantly better than the bare metal and comparable to the thermal grease.