Thermally-driven microfracture in high temperature metal matrix composites

Abstract

Microfracture (fiber/matrix fracture, interphase debonding and interply delamination) in high temperature metal matrix composites (HTMMC), subjected to thermal loading, is computationally simulated. Both unidirectional and crossply SiC/Ti15 composites are evaluated for microfracture driven by thermal loads, using multicell finite element models. Results indicate that under thermal loads alone, microfracture propagation is not as sensitive as it is under mechanical loads.